

Sanmina
https://sanmina.comFounded
Type
Size
Stage
About
Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina Corporationprovides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.
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Founded
2004
Type
Services
Size
1000-5000
Stage
Raised funding
About the company
Hero Electronix is the Hero Group’s venture into the technology space with a vision to create leading technology businesses from India. We intend to create scaled businesses by focusing on high growth domains centered around consumer products and enterprise solutions. Our partnership with Hero Electronix (www.heroelectronix.com) enables us to become a stronger turnkey solution provider by expanding our services portfolio and investing in the development of our technology expertise. We plan for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality. Tessolve is a leading end-to-end solution provider, from chip design, test engineering, and PCB engineering through embedded systems development. With 1600+ employees worldwide, Tessolve enables customers a faster time-to-market through deep domain expertise in Analog, Digital, Mixed Signal, and RF, broad ATE platform experience and built-in infrastructure including a test floor, characterization, reliability lab and PCB FAB. Tessolve allows customers to leverage high-end engineering in a cost-effective model by being able to scale teams to meet exact customer needs. Tessolve’s solution enables a seamless transition from development to production and beyond. With 90% Engineers, Tessolve offers a unique engineering model where we bridge the gap between pre and post-silicon development and final system integration. The chip design team focuses on end-to-end solutions for Analog, Digital & Mixed signal IP and full-chip SoC implementation. We offer flexibility to the customer by being able to provide individual services like DFT or turnkey chip implementation from RTL to GDS II sign-off. Tessolve provides services to an impressive group of global companies such as Qualcomm, Broadcom and NXP, that can attest to the quality of Tessolve’s work. Tessolve has engineering teams in India, Singapore, China, Malaysia and across Europe and North America.
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